Electronic component mounting method

ABSTRACT

In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated from an upper area of the component. The image taken by the camera is processed by a recognition processing unit to acquire a position of the component. A mounting head transporting mechanism positions the mounting head to the component based upon the recognition processing unit, and the component is picked up by the mounting head. Another camera transporting mechanism transports another camera over a board to take an image of the board. Thereafter, the camera is evacuated from an upper area of the board. The image taken of the board is processed by another recognition processing unit to determine a mounting position. The mounting head then positions the component on the board based upon the determined mounting position.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to an electronic component mountingapparatus and an electronic component mounting method, by whichelectronic components are mounted on boards.

2. Description of the Related Art

Conventionally, among electronic components (electronic parts) employedin electronic appliances, such electronic components which are suppliedunder such a condition that these electronic components such assemiconductor chips have been stuck onto sticking sheets are packaged,or mounted on boards such as lead frames by mounting apparatus equippedwith exclusively-used pick-up apparatus. In this pick-up apparatus,since chips (semiconductor chips) are required to be picked up in higherprecision by absorbing nozzles in this pick-up apparatus, which thesechips are stuck in a plane-lattice shape onto a sticking sheet held byan electronic components supplying unit, a component image taking camerais required so as to recognize positions of the chips on the stickingsheet.

Also, while a board on which a chip is packaged is mounted on a boardholding unit for a positioning purpose, in order to secure a bettermounting quality of this chip, such a board image taking camera isrequired. This board image taking camera is employed so as to recognizea position of the board on the board holding unit, to investigate acoating condition of adhesive agent for adhering the chip, and also toconfirm a mounting condition after the chip has been mounted. In otherwords, in such an electronic component mounting apparatus, under such acondition that two areas of both the electronic component supplying unitand the board holding unit are directed to transporting areas, mountingoperations are carried out in such a manner that three elements of amounting head, a component image taking camera, and a board takingcamera are relatively transported while these three elements aremutually cooperated.

However, in conventionally electronic component mounting apparatus,there are many cases that operations of mounting heads, component imagetaking cameras, and board image taking cameras provided in bothelectronic component supplying units and board holding units areconstituted in a series manner within the same cycle, and thus, anoccurrence of loss time cannot be avoided. In this loss time, none ofworks is carried out in the electronic component supplying units and/orthe board holding units. As a result, tact time of electronic componentmounting operation is delayed, so that there is a limitation inimprovements of work efficiencies.

SUMMARY OF THE INVENTION

Therefore, the present invention has an object to provide an electroniccomponent mounting apparatus and an electronic component mountingmethod, capable of shortening tack time and also capable of improving awork efficiency.

An electronic component mounting apparatus recited in claim 1 isfeatured by such an electronic component mounting apparatus for mountingan electronic component on an electronic component mounting position ofa board, comprising: an electronic component supplying unit forsupplying electronic components by arraying a plurality of theelectronic components in a plane shape; a board holding unit arranged ata position separated from the electronic component supply unit along afirst direction; a mounting head for picking up an electronic componentof the electronic component supplying unit to hold the picked electroniccomponent, and for mounting the held electronic component on anelectronic component mounting position of a board held by the boardholding unit; a mounting head transporting mechanism for transportingthe mounting head between the electronic component supplying unit andthe board holding unit; a first camera for taking an image of the boardheld by the board holding unit; a first camera transporting mechanismfor transporting the first camera over at least the board holding unit;a first recognition processing unit for processing an image taken by thefirst camera so as to acquire an actual position of the electroniccomponent mounting position of the board held by the board holding unit;a second camera for taking an image of the electronic component of theelectronic component supplying unit; a second camera transportingmechanism for transporting the second camera over at least theelectronic component supplying unit; a second recognition processingunit for processing an image of the second camera so as to acquire aposition of the electronic component of the electronic componentsupplying unit; mounting head transporting control means for controllingthe mounting head transporting mechanism so as to execute: (1) apositioning operation of the mounting head in the case that theelectronic component is picked up from the electronic componentsupplying unit based upon the position of the electronic componentacquired by the second recognition processing unit, and also in order toperform: (2) a positioning operation of the mounting head in the casethat the electronic component is mounted on the board of the boardholding unit based upon the actual position of the electronic componentmounting position acquired by the first recognition processing unit;first camera transporting control means for controlling the first cameratransporting mechanism so as to execute: (1) a positioning operation ofthe first camera in the case that an image of the board held by theboard holding unit is taken, and also in order to perform: (2) anevacuating operation for transporting the first camera to a positionwhere mounting of the electronic component by the mounting head is notdisturbed; and second camera transporting control means for controllingthe second camera transporting mechanism so as to execute: (1) apositioning operation of the second camera in the case that an image ofthe electronic component of the electronic component supplying unit istaken, and also in order to perform: (2) an evacuating operation fortransporting the second camera to a position where the pick-up operationof the electronic component by the mounting head is not disturbed.

An electronic component mounting apparatus recited in claim 2 isfeatured by that the first camera takes an image of the electroniccomponent mounting position of the board so as to acquire an imagethereof, and the first recognition processing unit processes the imagein order to acquire the actual position of the electronic componentmounting position.

An electronic component mounting apparatus recited in claim 3 isfeatured by that the first camera takes images of both the electroniccomponent mounting position and adhesive agent coated at the electroniccomponent mounting position so as to acquire images thereof; and thefirst recognition processing unit processes the acquired images in orderto acquire the actual position of the electronic component mountingposition and also to investigate a coating condition of adhesive agentcoated at the electronic component mounting position.

An electronic component mounting apparatus recited in claim 4 isfeatured by that the first camera takes an image of the electroniccomponent mounting position of the board on which the electroniccomponent is mounted to acquire an image thereof; the first recognitionprocessing unit processes the acquired image taken by the first cameraso as to investigate a mounting condition of the electronic component;and the first camera transporting control means causes the first cameratransporting mechanism to execute a positioning operation of the firstcamera in the case that the first camera takes an image of theelectronic component mounting position of the board on which theelectronic component is mounted.

An electronic component mounting apparatus recited in claim 5 isfeatured by that the mounting head transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the mounting head along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the mounting headalong the second direction guide.

An electronic component mounting apparatus recited in claim 6 isfeatured by that the first camera transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the first camera along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the first camera alongthe second direction guide.

An electronic component mounting apparatus recited in claim 7 isfeatured by that the second camera transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the second camera along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the second cameraalong the second direction guide.

An electronic component mounting apparatus recited in claim 8 isfeatured by that the mounting head transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a center beam member equipped with a second directionguide, both ends of which are supported by the paired first directionguides, and which guides the mounting head along a second directionlocated perpendicular to the first direction; a first direction drivemechanism for transporting the center beam member along the firstdirection guides; and a second direction drive mechanism fortransporting the mounting head along the second direction guide; thefirst camera transporting mechanism includes: a first beam memberequipped with a second direction guide, both ends of which are supportedby the paired first direction guides, and which guides the first cameraalong a second direction located perpendicular to the first direction; afirst direction drive mechanism for transporting the first beam memberalong the first direction guides; and a second direction drive mechanismfor transporting the first camera along the second direction guide; andthe second camera transporting mechanism includes: a second beam memberequipped with a second direction guide, both ends of which are supportedby the paired first direction guides, and which guides the second cameraalong a second direction located perpendicular to the first direction; afirst direction drive mechanism for transporting the second beam memberalong the first direction guides; and a second direction drive mechanismfor transporting the second camera along the second direction guide.

An electronic component mounting apparatus recited in claim 9 isfeatured by that both a third camera for taking an image of theelectronic component held by the mounting head, and a third recognitionprocessing unit for processing the image taken by the camera so as toacquire a position of the electronic component held by the mounting headare provided between the electronic component supplying unit and theboard holding unit; and the mounting head transporting control meanscontrols the mounting head transporting mechanism so as to execute: (1)a positioning operation of the mounting head in the case that theelectronic component is picked up from the electronic componentsupplying unit based upon the position of the electronic componentacquired by the second recognition processing unit, and also in order toperform: (2) a positioning operation of the mounting head in the casethat the electronic component is mounted on the board of the boardholding unit based upon the actual position of the electronic componentmounting position acquired by the first recognition processing unit, andalso the position of the electronic component acquired by the thirdrecognition processing unit.

An electronic component mounting apparatus recited in claim 10 isfeatured by that the board holding unit is comprised of a plurality ofboard holding mechanisms for holding boards.

An electronic component mounting apparatus recited in claim 11 isfeatured by that the electronic component mounting apparatus is furthercomprised of: a board carry-in conveyor for carrying a board in theelectronic component mounting apparatus; a board bring-out conveyor forbringing out a board on which an electronic component has been mountedfrom the electronic component mounting apparatus; a board apportioningunit for receiving boards from the board carry-in conveyor and forapportioning the received boards one by one to the plurality of boardholding mechanisms so as to transport the boards; and a boardreceiving/supplying unit for receiving the boards on which theelectronic components have been mounted from the plurality of boardholding mechanisms and for supplying the received boards to the boardbring-out conveyor.

An electronic component mounting apparatus recited in claim 12 isfeatured by that the electronic component supplying unit is comprised ofa jig holding unit for detachably holding a jig having a sticking sheeton which a plurality of electronic components have been stuck.

An electronic component mounting apparatus recited in claim 13 isfeatured by that a sticking sheet exfoliating mechanism for exfoliatingan electronic component picked up by the mounting head from the stickingsheet is provided under the sticking sheet.

An electronic component mounting apparatus recited in claim 14 isfeatured by that the mounting head is equipped with a plurality ofnozzles which each holds one of the electronic components, and ismovable under such a condition that the plurality of electroniccomponents are held.

An electronic component mounting method recited in claim 15 is featuredby that in an electronic component mounting method executed by anelectronic component mounting apparatus comprising: a mounting head forpicking up an electronic component of an electronic component supplyingunit to hold the picked electronic component, and for mounting the heldelectronic component on an electronic component mounting position of aboard held by a board holding unit; a mounting head transportingmechanism for transporting the mounting head between the electroniccomponent supplying unit and the board holding unit; a first camera fortaking an image of the board held by the board holding unit; a firstcamera transporting mechanism for transporting the first camera over atleast the board holding unit; a first recognition processing unit forprocessing an image taken by the first camera so as to acquire an actualposition of the electronic component mounting position of the board heldby the board holding unit; a second camera for taking the electroniccomponent of the electronic component supplying unit; a second cameratransporting mechanism for transporting the second camera over at leastthe electronic component supplying unit; a second recognition processingunit for processing an image of the second camera so as to acquire aposition of the electronic component of the electronic componentsupplying unit; the electronic mounting method is comprised of:

a first step in which the second camera is transported to the electroniccomponent supplying unit by the second camera transporting mechanism totake an image of an electronic component, and thereafter the secondcamera is evacuated from an upper area of the electronic component bythe second camera transporting mechanism; a second step in which animage taken by the second camera is processed by the second recognitionprocessing unit so as to acquire a position of the electronic component;a third step in which while the mounting head transporting mechanismexecutes a positioning operation for positioning the mounting head tothe electronic component based upon the position of the electroniccomponent acquired by the second recognition processing unit, theelectronic component is picked up by the mounting head; a fourth step inwhich the first camera is transported by the first camera transportingmechanism over a board held by the board holding unit so as to take animage of the board by the first camera, and thereafter the first camerais evacuated from an upper area of the board by the first cameratransporting mechanism; a fifth step in which the image taken by thefirst camera is processed by the first recognition processing unit so ato acquire an actual position of the electronic component mountingposition of the board; and a sixth step in which while the mounting headtransporting mechanism executes a positioning operation for positioningthe mounting head to the electronic component mounting position basedupon the actual position of the electronic component mounting positionacquired by the first recognition processing unit, the electroniccomponent held by the mounting head is mounted on the electroniccomponent mounting position; wherein: while the electronic componentheld by the mounting head is mounted on the electronic componentmounting position, the second camera is again transported over theelectronic component supporting unit so as to take an image of anelectronic component which is subsequently picked up by the secondcamera.

An electronic component mounting method recited in claim 16 is featuredby that the first camera takes the electronic component mountingposition of the board so as to acquire an image thereof in the fourthstep, and the first recognition processing unit processes the image inorder to acquire the actual position of said electronic componentmounting position in the fifth step.

An electronic component mounting method recited in claim 17 is featuredby that the first camera takes both the electronic component mountingposition and adhesive agent coated at the electronic component mountingposition so as to acquire images thereof in the fourth step; and thefirst recognition processing unit processes the acquired images in orderto acquire the actual position of the electronic component mountingposition and also to investigate a coating condition of adhesive agentcoated at the electronic component mounting position in the fifth step.

An electronic component mounting method recited in Clam 18 is featuredby that the electronic component mounting method is further comprisedof: a seventh step in which the first camera transporting mechanismtransports the first camera over an electronic component mountingposition of the board on which the electronic component has been mountedso as to take the electronic component mounting position; and an eighthstep in which the image taken in the seventh step is processed by thefirst recognition processing unit so as to investigate a mountingcondition of the electronic component.

An electronic component mounting method recited in claim 19 is featuredby that the subsequent fourth step is continuously carried out after theseventh step.

An electronic component mounting method recited in claim 20 is featuredby that in an electronic component mounting method executed by anelectronic component mounting apparatus comprising: a mounting head forpicking up an electronic component of an electronic component supplyingunit to hold the picked electronic component, and for mounting the heldelectronic component on an electronic component mounting position of aboard held by a board holding unit; a mounting head transportingmechanism for transporting the mounting head between the electroniccomponent supplying unit and the board holding unit; a first camera fortaking an image of the board held by the board holding unit; a firstcamera transporting mechanism for transporting the first camera over atleast the board holding unit; a first recognition processing unit forprocessing an image taken by the first camera so as to acquire an actualposition of the electronic component mounting position of the board heldby the board holding unit; a second camera for taking an image of theelectronic component of the electronic component supplying unit; asecond camera transporting mechanism for transporting the second cameraover at least the electronic component supplying unit; a secondrecognition processing unit for processing an image of the second cameraso as to acquire a position of the electronic component of theelectronic component supplying unit;

the electronic mounting method is comprised of: a first step in whichthe second camera is transported to the electronic component supplyingunit by the second camera transporting mechanism to take an image of aplurality of electronic components, and thereafter the second camera isevacuated from an upper area of the plural electronic components by thesecond camera transporting mechanism; a second step in which imagestaken by the second camera are processed by the second recognitionprocessing unit so as to acquire positions of the plural electroniccomponents; a third step in which while the mounting head transportingmechanism executes a positioning operation for sequentially positioningthe mounting head to the plural electronic components based upon thepositions of the plural electronic components acquired by the secondrecognition processing unit, the plural electronic components aresequentially picked up by the mounting head; a fourth step in which thefirst camera is transported by the first camera transporting mechanismover a board held by the board holding unit so as to take an image ofthe board by the first camera, and thereafter the first camera isevacuated from an upper area of the board by the first cameratransporting mechanism; a fifth step in which the image taken by thefirst camera is processed by the first recognition processing unit so ato acquire actual positions of the plural electronic component mountingpositions of the board; and a sixth step in which while the mountinghead transporting mechanism executes a positioning operation forsequentially positioning the mounting head to the plural electroniccomponent mounting positions based upon the positions of the pluralelectronic component mounting positions acquired by the firstrecognition processing unit, the plural electronic components held bythe mounting head are sequentially mounted on the plural electroniccomponent mounting positions; wherein: while the electronic componentsheld by the mounting head are sequentially mounted on the pluralelectronic component mounting positions, the second camera is againtransported over the electronic component supporting unit so as to takean image of a plurality of electronic components which are subsequentlypicked up by the second camera.

An electronic component mounting method recited in claim 21 is featuredby that the first camera takes images of a plurality of electroniccomponent mounting positions of the board so as to acquire imagesthereof in the fourth step, and the first recognition processing unitprocesses the images in order to acquire the actual positions of theplural electronic component mounting positions in the fifth step.

An electronic component mounting method recited in claim 22 is featuredby that the first camera takes images of both the plural electroniccomponent mounting positions and adhesive agent coated at the pluralelectronic component mounting positions so as to acquire images thereofin the fourth step; and the first recognition processing unit processesthe acquired images in order to acquire the actual positions of theplural electronic component mounting positions and also to investigatecoating conditions of adhesive agent coated at the plural electroniccomponent mounting positions in the fifth step.

An electronic component mounting method recited in claim 23 is featuredby that the electronic component mounting method is further comprisedof: a seventh step in which the first camera transporting mechanismtransports the first camera over a plurality of electronic componentmounting positions of the board on which the electronic components havebeen mounted so as to take images of the plural electronic componentmounting positions; and an eighth step in which the images taken in theseventh step are processed by the first recognition processing unit soas to investigate mounting conditions of the plural electroniccomponents.

An electronic component mounting method recited in claim 24 is featuredby that the subsequent fourth step is continuously carried out after theseventh step.

In accordance with the present invention, while the electronic componentmounting apparatus is provided with the mounting head transportingmechanism for transporting the mounting head which mounts/transports theelectronic component between the electronic component supplying unit andthe board holding unit; the first camera transporting mechanism fortransporting the first camera which takes an image of the board in theboard holding unit over at least the board holding unit; and the secondcamera transporting mechanism for transporting the second camera whichtakes an image of the electronic component of the electronic componentsupplying unit over at least the electronic component supplying unit,since both the electronic component supplying unit and the board holdingunit are defined as the range to be transported, and the mounting head,the first camera, and the second camera are relatively traveled inconjunction to each other, the occurrence of loss time in both theelectronic component supplying unit and the board holding unit can beavoided, and the tact time can be shortened to improve the workefficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view for indicating an electronic component mountingapparatus according to one embodiment mode of the present invention;

FIG. 2 is a side/sectional view for showing the electronic componentmounting apparatus of one embodiment mode of the present invention;

FIG. 3 is a plan/sectional view for showing the electronic componentmounting apparatus of one embodiment mode of the present invention;

FIG. 4 is a block diagram for indicating an arrangement of a controlsystem of the electronic component mounting apparatus according to oneembodiment mode of the present invention;

FIG. 5 is a functional block diagram for showing a processing functionof the electronic component mounting apparatus according to oneembodiment mode of the present invention;

FIGS. 6A and 6B are explanatory diagrams for explaining process steps ofan electronic component mounting method according to an embodiment modeof the present invention;

FIGS. 7A and 7B are explanatory diagrams for explaining process steps ofthe electronic component mounting method according to the embodimentmode of the present invention;

FIGS. 8A and 8B are explanatory diagrams for explaining process steps ofthe electronic component mounting method according to the embodimentmode of the present invention;

FIGS. 9A and 9B are explanatory diagrams for explaining process steps ofthe electronic component mounting method according to the embodimentmode of the present invention; and

FIGS. 10A, 10B, 10C, and 10D are plan views for indicating a board towhich an electronic component is mounted, according to an embodimentmode of the present invention.

In the figures, a reference numeral 2 refers to an electronic componentsupplying unit; 3 to a jig holder; 4 to a jig; 5 to a stocking sheet; 6to a chip; 7 to an ejector-XY-table; 8 to an ejector; 10 to a boardholding unit; 10A to a first board holding mechanism; 10B to a secondboard holding mechanism; 12 to a board carry-in conveyor; 14 to a boardbring-out conveyor; 15 to a third camera; 16 to a board; 16 a to anelectronic component mounting position; 17 to an adhesive agent; 30 to acenter beam member; 31 to a first beam member; 32 to a second beammember; 33 to a mounting head; 34 to a first camera; 35 to a secondcamera; 50 to a mechanism driving unit; 53 to a data storage unit; 54 toa control unit; 55 to a first recognition processing unit; 56 to asecond recognition processing unit; and 57 to a third recognitionprocessing unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to drawings, embodiment modes of the present inventionwill be described. FIG. 1 is a plan view for showing an electroniccomponent mounting apparatus according to one embodiment mode of thepresent invention, FIG. 2 is a side/sectional view for representing theelectronic component mounting apparatus according to one embodiment modeof the present invention, and FIG. 3 is a plan/sectional diagram forindicating the electronic component mounting apparatus according to oneembodiment mode of the present invention. FIG. 4 is a block diagram forindicating an arrangement of a control system of the electroniccomponent mounting apparatus according to one embodiment mode of thepresent invention, and FIG. 5 is a functional block diagram for showingprocess functions of the electronic component mounting apparatusaccording to one embodiment mode of the present invention. FIGS. 6A and6B, FIGS. 7A and 7B, FIGS. 8A and 8B, and FIGS. 9A and 9B areexplanatory diagrams for explaining process steps of an electroniccomponent mounting method according to one embodiment mode of thepresent invention, and FIGS. 10A, 10B, 10C, and 10D are plan views forrepresenting boards on which electronic components will be mounted,according to one embodiment mode of the present invention.

First, an overall construction of an electronic component mountingapparatus will now be described with reference to FIG. 1, FIG. 2, andFIG. 3. FIG. 2 is the sectional view for indicating this electroniccomponent mounting apparatus, taken along an arrow A-A of FIG. 1, andFIG. 3 is the sectional view of representing this electronic componentmounting apparatus, taken along an arrow B-B of FIG. 1. In FIG. 1, anelectronic component supplying unit 2 is arranged on a base board 1. Asshown in FIG. 2 and FIG. 3, the electronic component supplying unit 2 isequipped with a jig holder (jig holding unit) 3. The jig holder 3detachably holds a jig 4 on which a sticking sheet 5 is mounted.Semiconductor chips 6 (will be simply abbreviated as “chips 6”hereinafter) corresponding to electronic components (electronic parts)are stuck on the sticking sheet 5 under such a condition that thesechips 6 are individually separated from each other. Under such acondition that the jig 4 is held by the jig holder 3, the electroniccomponent supplying unit 2 supplies the chips 6 by arranging a pluralityof semiconductor chips in a plane shape.

As indicated in FIG. 2, an ejector 8 is arranged under the stickingsheet 5 held by the jig holder 3 in such a manner that this ejector 8can be horizontally transported by an ejector-XY-table 7. The ejector 8is equipped with a pin elevation mechanism for elevating a chip-raisingejector pin (not shown). In the case that the chips 6 are picked up fromthe sticking sheet 5 by a mounting head (will be explained later), thechips 6 are raised from the lower portion of the sticking sheet 5 by theejector pin, so that the chips 6 are exfoliated from the sticking sheet5. The ejector 8 constitutes a sticking sheet exfoliating mechanism forexfoliating the chips 6 form the sticking sheet 5.

As shown in FIG. 3, a board holding unit 10 is arranged at such aposition separated from the electronic component supplying unit 2provided on the upper plane of the base board 1 along a Y direction(namely, first direction). On the upper stream side and the lower streamside of the board holding unit 10, a board carry-in conveyor 12, a boardapportioning unit 11, a board holding unit 10, a boardreceiving/supplying unit 13, and a board bring-out conveyor 14 arearranged in a series manner along an X direction. The board carry-inconveyor 12 is arranged in such a manner that the board carry-inconveyor 12 rides on a sub-board base 1 a coupled to the board base 1.An adhesive agent coating apparatus 9 is arranged on the sub-board base1 a. The adhesive agent coating apparatus 9 coats adhesive agent 17 (seeFIGS. 10A to 10D) for adhering the chips 6 by a coating head 9 a withrespect to a board 16 which has been carried in the board carry-inconveyor 12 from the upper stream side.

The board 16 on which the adhesive agent has been coated is transportedto the board apportioning unit 11. The board apportioning unit 11 isconstructed in such a manner that an apportioning conveyor 11 a can beslid along the Y direction by a slide mechanism 11 b. This boardapportioning unit 11 selectively apportions the boards 16 received fromthe board carry-in conveyor 12 to two sets of board holding mechanisms(will be explained later) of the board holding unit 10. The boardholding unit 10 is provided with a first board holding unit 10A and asecond board holding unit 10B. This board holding unit 10 holds theboard 16 apportioned by the board apportioning unit 11 so as to positionthis held board 16 at a mounting position.

The board receiving/supplying unit 13 is arranged in such a manner thata receiving/supplying conveyor 13 a can be slid by a slide mechanism 13b along the Y direction similar to the board apportioning unit 11. Thereceiving/supplying conveyor 13 c is selectively connected to a firstboard holding mechanism 10A and a second board holding mechanism 10B, sothat this receiving supplying conveyor 13 a receives the board 16 onwhich the chips 6 have been packaged, and then supplies this receivedboard 16 to the board bring-out conveyor 14. The board bring-outconveyor 14 brings out the supplied board 16 on which the chips 6 havebeen mounted to the down stream side.

In FIG. 1, both a first Y-axis base 20A and a second Y-axis base 20B arearranged on both edge portions of an upper plane of the base board 1 insuch a manner that longitudinal directions of the first and secondY-axis bases 20A/20B are directed to the Y direction (first direction)located perpendicular to the board carrying direction (X direction). Apair of first direction guide 21 are arranged on an upper plane of thefirst Y-axis base 20A and an upper plane of the second X-axis base 20Bin such a manner that the first direction guides 21 are locatedsubstantially over entire lengths thereof along a longitudinal direction(Y direction), and one pair of these first direction guides 21 arepositioned in parallel thereto and also sandwich both the electroniccomponent supplying unit 2 and the board holding unit 10.

Three sets of beam members (namely, a first beam member 31, a centerbeam member 30, and a second beam member 32) are suspended by thesepaired first direction guides 21 in such a manner that both edgeportions of each of these three beam members 30, 31, 32 are supported bythe first direction guides 21 and can be freely slid along the Ydirection.

A nut member 23 b is projected on a side edge portion of a right side ofthis center beam member 30, and a feed screw 23 a meshed with the nutmember 23 b is rotated by a Y-axis motor 22 which is arranged on thefirst Y-axis base 20A along the horizontal direction. Since the Y-axismotor 22 is driven, the center beam member 30 is horizontallytransported along the Y-direction along the first direction guides 21.

Also, nut members 25 b and 27 b are projected on side edge portions ofleft sides of the first beam member 31 and the second beam member 32.Feed screws 25 a and 27 a which are meshed to these nut members 25 b and27 b are rotated by Y-axis motors 24 and 26, which are arranged on thesecond Y-axis base 20B respectively along the horizontal direction.Since the Y-axis motors 24 and 26 are driven, both the first beam member31 and the second beam member 32 are horizontally transported in the Ydirection along the first direction guides 21.

A mounting head 33 is mounted on the center beam member 30, and a feedscrew 41 a which is meshed with a nut member 41 b coupled to thismounting head 33 is rotated by an X-axis motor 40. Since the X-axismotor 40 is driven, the mounting head 33 is guided by a second directionguide (see FIG. 2) so as to be transported along the X direction. Thissecond direction guide 42 is provided on a side plane of the center beammember 30.

The mounting head 33 is provided with plural sets (four sets in thiscase) of nozzles 33 a for holding one piece of chip 6. The mounting head33 may be transported under such a condition that each of the chips 6 isabsorbed by each of the nozzles 33 a, and a plurality of chips 6 areheld. Since both the Y-axis motor 22 and the X-axis motor are driven,the mounting head 33 is horizontally transported along the X directionand the Y direction, picks up the chips 6 of the electronic componentsupplying unit 2, and then, mounts the held chips 6 on an electroniccomponent mounting position 16 a of the board 16 held by the electroniccomponent supplying unit 2.

One pair of the first direction guides 21, the center beam member 30, afirst direction drive mechanism (namely, Y-axis motor 22, feed screw 23a, and nut member 23 b), and also a second director drive mechanism(namely, X-axis motor 40, feed screw 41 a, and nut member 41 b)constitute a mounting head transporting mechanism for transporting themounting head 33 between the electronic component supplying unit 2 andthe board holding unit 10. The first direction drive mechanismtransports the center beam member 30 along the first direction guides21, whereas the second direction drive mechanism transports the mountinghead 33 along the second direction guide 42.

A first camera 34 is mounted on the first beam member 31, and a nutmember 44 b is coupled to a bracket 34 a for holding this first camera34. A feed screw 44 a meshed with the nut member 44 b is rotated by anX-axis motor 43. Since the X-axis motor 43 is driven, the first camera34 is guided by a second direction guide 45 (see FIG. 2) provided on aside plane of the first beam member 31 so as to be transported along theX-direction.

Since both the Y-axis motor 24 and the X-axis motor 43 are driven, thefirst camera 34 is horizontally transported along the X direction andthe Y direction. As a result, the first camera 34 can be transportedover the board holding unit 10 and also can be transported so as to beevacuated from the board holding unit 10 in order that this first camera34 images, or takes an image of the board 16 which is held by the firstboard holding mechanism 10A and the second board holding mechanism 10Bof the board holding unit 10.

One pair of the first direction guides 21, a first beam member 31, afirst direction drive mechanism (namely, Y-axis motor 24, feed screw 25a, and nut member 25 b), and also a second direction drive mechanism(namely, X-axis motor 43, feed screw 44 a, and nut member 44 b)constitute a first camera transporting mechanism for transporting atleast the first camera 34 over the board holding unit 10. The firstdirection drive mechanism transports the first beam member 31 along thefirst direction guides 21, whereas the second direction drive mechanismtransports the first camera 34 along the second direction guide 45.

A second camera 35 is mounted on the second beam member 32, and a nutmember 47 b is coupled to a bracket 35 a for holding this second camera35. A feed screw 47 a meshed with the nut member 47 b is rotated by anX-axis motor 46. Since the X-axis motor 46 is driven, the second camera35 is guided by a second direction guide 48 (see FIG. 2) provided on aside plane of the second beam member 32 so as to be transported alongthe X-direction.

Since both the Y-axis motor 26 and the X-axis motor 46 are driven, thesecond camera 35 is horizontally transported along the X direction andthe Y direction. As a result, the second camera 35 can be transportedover the electronic component supplying unit 2 and also can betransported so as to be evacuated from the electronic componentsupplying unit 2 in order that this second camera 35 takes images of thechips 6 held by the electronic component supplying unit 2.

One pair of the first direction guides 21, a second beam member 32, afirst direction drive mechanism (namely, Y-axis motor 26, feed screw 27a, and nut member 27 b), and also a second direction drive mechanism(namely, X-axis motor 46, feed screw 47 a, and nut member 47 b)constitute a second camera transporting mechanism for transporting atleast the second camera 35 over the electronic component supplying unit2. The first direction drive mechanism transports the second beam member32 along the first direction guides 21, whereas the second directiondrive mechanism transports the second camera 35 along the seconddirection guide 48.

As indicated in FIG. 3, a third camera 15 is arranged between theelectronic component supplying unit 2 and the board holding unit 10.Since the mounting head 33 which has picked up the chip 6 is transportedover the third camera 15 in the electronic component supplying unit 2,the third camera 15 takes images of the chips 6 held on the mountinghead 33.

Referring now to FIG. 4, an arrangement of a control system of anelectronic component mounting apparatus will be explained. In FIG. 4, amechanism driving unit 50 is arranged by a motor driver forelectronically driving motors of the below-mentioned respectivemechanisms, and a control appliance for controlling air pressuresupplied to air cylinders of the respective mechanisms. Since thismechanism driving unit 50 is controlled by a control unit 54, thebelow-mentioned respective drive elements.

Both the X-axis motor 40 and the Y-axis motor 22 drive a mounting headtransport mechanism for transporting the mounting head 33. Both theX-axis motor 43 and the Y-axis motor 24 drive the first cameratransporting mechanism for transporting the first camera 34, and boththe X-axis motor 46 and the Y-axis motor 26 drive the second cameratransporting mechanism for transporting the second camera 35.

Also, the mechanism driving unit 50 drives an elevating mechanism of themounting head 33, and a component absorbing mechanism constructed ofnozzles 33 a (see FIG. 2), drives an elevating cylinder of the ejector8, and also a drive motor of the ejector-XY table 7. Furthermore, themechanism driving unit 50 drives the board carry-in conveyor 12, theboard bring-out conveyor 14, the board apportioning unit 11, the boardreceiving/supplying unit 13, the first board holding mechanism 10A, andthe second board holding mechanism 10B.

A first recognition processing unit 55 processes an image taken by thefirst camera 34 to acquire a position of an electronic componentmounting position 16 a (see FIGS. 10A to 10D) of the board 16 held bythe board holding unit 10. The electronic component mounting position 16a indicates a mounting position of a chip 6 on the board 16, from whichthe position can be detected by the image recognition. Also, the firstrecognition processing unit 55 processes the image taken by the firstcamera 34 so as to check a coating condition of an adhesive agent 17coated at the electronic component mounting position 16 a, and furtherso as to check a mounting condition of the chip 6 mounted on theadhesive agent 17.

A second recognition processing unit 56 processes an image taken by thesecond camera 35 in order to acquire a position of a chip 6 of theelectronic component supplying unit 2. A third recognition processingunit 57 processes an image taken by the third camera 15 so as to acquirea position of a chip 6 mounted on the mounting head 33.

The recognition results obtained from the first recognition processingunit 55, the second recognition processing unit 56, and the thirdrecognition processing unit 57 are supplied to the control unit 54. Adata storage unit 53 stores thereinto various sorts of data such asinvestigation results, namely, coating condition investigation of theadhesive agent 17 and mounting condition investigation of the chips 6(will be explained later). An operation unit 51 corresponds to an inputapparatus such as a keyboard and a mouse, and enters data and a controlcommand. A display unit 52 displays thereon imaging screens produced bythe first camera 34, the second camera 35, and the third camera 15, andalso displays thereon a guide screen when an input operation isperformed by the operation unit 51.

Next, a description will now be made of processing functions of theelectronic component mounting apparatus with reference to FIG. 5. InFIG. 5, a broken line frame 54 indicates a processing function executedby the control unit 54 shown in FIG. 4. In this case, processingfunctions executed by a first camera transporting process unit 54 a, asecond camera transporting process unit 54 b, and a mounting headtransporting process unit 54 c constitute a first camera transportingcontrol means, a second camera transporting control means, and amounting head transporting control means, respectively.

The first camera transporting process unit 54 a controls the firstcamera transporting mechanism so as to execute a positioning operationof the first camera 34 when an image of the board 16 held by the boardholding unit 10 is taken by this first camera 34, and also execute suchan evacuating operation that the first camera 34 is moved to a positionwhich does not disturb mounting operation of the chips 6 by the mountinghead 33. In this case, three different sorts of the board 16 are carriedout, namely an image of the electronic component mounting position 16 abefore the chips 6 are mounted is taken; an image of the adhesive agent17 contained in the electronic component mounting position 16 a beforethe chips 6 are mounted is taken; and also, an image of the electroniccomponent mounting position 16 a after the chips have been mounted istaken.

The second camera transporting process unit 54 b controls the secondcamera transporting mechanism so as to execute a positioning operationof the second camera 35 when an image of the chip 6 of the electroniccomponent supplying unit is taken by this second camera 35, and also toexecute such an evacuating operation that the second camera 35 is movedto a position which does not disturb picking-up operation of anelectronic component by the mounting head 33.

The mounting head transporting process unit 54 c is provided with twoprocessing functions of a pick-up operation processing unit 54 d and amount operation processing unit 54 e. The pick-up operation processingunit 54 d controls the mounting head transporting mechanism so as toexecute a positioning operation of the mounting head 33 in the case thatthe chips 6 are picked up from the electronic component supplying unit 2based upon positions of the chips 6 acquired by the second recognitionprocessing unit 56. The mount operation processing unit 54 e controlsthe mounting head transporting mechanism so as to execute a positioningoperation of the mounting head 33 in the case that the chips 6 aremounted on the board 16 of the board holding unit 10 based uponpositions of the chips 6 acquired by the third recognition processingunit 57, and a position of the electronic component mounting position 16a acquired by an electronic component mounting position detectingprocess unit 55 a of the first recognition processing unit 55.

The first recognition processing unit 55 contains a coating conditioninvestigation processing unit 55 b and a mounting conditioninvestigation processing unit 55 c other than the above-describedelectronic component mounting position detection processing unit 55 a.While the mount operation processing unit 54 e executes the mountingoperation, the mounting operation of a chip 6 is carried out only as tosuch an electronic component mounting position whose coating conditionis judged as “good” by referring to a result of adhesive agent coatinginvestigation of the chip 6, which is detected by the coating conditioninvestigation processing unit 55 b.

As a result of the above-described adhesive agent coating conditioninvestigation obtained by the coating condition investigation processingunit 55 b, an investigation result recording process unit 54 f executesa process operation used to store the mounting condition investigationresults of the chips 6 obtained by the mounting condition investigationprocessing unit 55 c. The data of these investigation results aresupplied to the investigation result recording process unit 54 f so asto be processed, and then, the processed data are stored into theinvestigation result storage unit 53 a provided in the data storage unit53.

While this electronic component mounting apparatus is arranged inaccordance with the above-described manner, an electronic componentmounting method will now be explained with reference to FIG. 6A to FIG.10D. In FIGS. 6A and 6B, a large number of chips 6 have been stuck ontothe sticking sheet 5 of the jig 4 held by the electronic componentsupplying unit 2. Also, the boards 16 are positioned on the first boardholding mechanism 10A and the second board holding mechanism 10B,respectively, in the board holding unit 10. In this electronic componentmounting method shown in this drawing, a plurality (four pieces in thiscase) of chips 6 are sequentially absorbed and held by four sets of theabsorbing nozzles 33 a provided on the mounting head 33, and then, thesefour chips 6 are sequentially mounted on a plurality of electroniccomponent mounting positions 16 a within one mounting turn.

First, as shown in FIG. 6A, the second camera 35 is transported over theelectronic component supplying 2 by the second camera transportingmechanism, and then, images of a plurality (four pieces) of chips 6which will be picked up are taken by the second camera 35. Thereafter,as shown in FIG. 6B, the second camera 35 is evacuated from the upperareas of these six chips 6. Then, images taken by the second camera 35are processed by the second recognition processing unit 56 so as toacquire positions of the plural chips 6.

Next, the mounting head 33 is moved over the electronic componentsupplying unit 2. Then, while such a positioning operation is carriedout by the mounting head transporting mechanism, a plurality of chips 6are sequentially picked up by the four absorbing nozzles 33 a of themounting head 33. In this positioning operation, the mounting head 33 issequentially positioned onto these chips 6 based upon the acquiredpositional data of these plural chips 6.

In conjunction with this pick-up operation, the first camera 34 istransported over the board 16 held by the first board holding mechanism10A of the board holding unit 10 by the first camera transportingmechanism. Then, as shown in FIG. 10A, the first camera 34 issequentially transported in such a manner that an image acquisitionrange 18 sequentially surrounds four sets of left-sided electroniccomponent mounting positions 16 a among eight sets of electroniccomponent mounting positions 16 a which are set to the board 16, andthen, this first camera 34 takes images of a plurality of theseelectronic component mounting positions 16 a and the adhesive agent 17coated inside these electronic component mounting positions 16 a.Thereafter, the first camera 34 is evacuated from the upper area of thisboard 16.

Then, the images of the image acquisition range 18 taken by the firstcamera 34 are processed by the first recognition processing unit 55 soas to acquire actual positions of the electronic component mountingpositions 16 a (see FIG. 10A) of the board 16. While this board 16 isrecognized, an image of the adhesive agent 17 coated inside a pluralityof electronic component mounting positions 16 a before the chips 6 havebeen mounted is taken by the first camera 34 in connection with theposition detections of the electronic component mounting positions 16 a,so as to investigate coating conditions of the adhesive agent 17 coatedon the respective electronic component mounting positions 16 a. In otherwords, a judgment is made as to whether or not such an adhesive agent 17having a proper coating amount has been coated at a correct coatingposition.

Next, as shown in FIG. 7A, the mounting head 33 in which the four chips6 are held by the respective absorbing nozzles 33 a is transported overthe third camera 15, namely performs a scanning operation. As a result,images of the chips 6 held by the respective absorbing nozzles 33 a areacquired by the third camera 15. Since this acquired image isrecognition-processed by the third recognition processing unit 57,actual positions of these chips 6 may be detected.

Subsequently, this scanning operation is advanced to a mountingoperation. At this time, mounting operations of the chip 6 are carriedout as to only such electronic component mounting positions 16 a whichhave been judged as the good coating conditions by the first recognitionprocessing unit 55. As represented in FIG. 7B, the mounting head 33 istransported over the board holding unit 10 as shown in FIG. 7B. Then, inthis case, the mounting operation is carried out based upon thepositions of the electronic component mounting positions 16 a acquiredby the first recognition processing unit 55, the positions of the chips6 acquired by the third recognition processing unit 57, and the judgmentresult by investigating the coating conditions.

In other words, while the mounting head transporting mechanism executessuch a positioning operation, the chips 6 held by the mounting head 33are mounted one by one on the adhesive agent 17 coated inside suchelectronic component mounting positions 16 a whose coating conditionshave been judged as “good.” In this positioning operation, the chips 6held by the absorbing nozzles 33 a of the mounting head 33 aresequentially positioned onto such electronic component mountingpositions 16 a whose coating conditions have been judged as “good” amonga plurality of electronic component mounting positions 16 a of the board16 positioned on the first board holding mechanism 10A.

Then, when the mounting head 33 mounts the chips, the second camera 35is transported over a plurality of chips 6 which are subsequently pickedup in the electronic component supplying unit 2, and then, the pluralchips 6 are taken by the second camera 35. Then, as indicated in FIG.8A, the second camera 35 is evacuated from the upper area of theseplural chips 6 and thereafter, the mounting head 33 is transported overthe electronic component supplying unit 2. Then, while the mounting headtransporting mechanism performs such a positioning operation forpositioning the mounting head 33 to this chip 6 based upon the positionsof the chips 6 acquired by the second recognition processing unit 56, aplurality of chips 6 are sequentially picked up by the four absorbingnozzles 33 a of the mounting head 33.

Then, while the chips 6 are picked upon in the electronic componentsupplying unit 2, the first camera 34 is transported over the firstboard holding mechanism 10A of the board holding unit 10 so as to takean image of the board 16. In this case, the followinginvestigation/detection are carried out. That is, mounting conditions ofthe chips 6 mounted on the board 16 are investigated; positions of aplurality of electronic component mounting positions 16 a are detectedon which the chips 6 are mounted in a next mounting turn; and coatingconditions of adhesive agent 17 coated on these electronic componentmounting positions 16 a are investigated.

In other words, as shown in FIG. 10C, in this image taking operation,the first camera 34 is sequentially transported so as to acquire imagesin such a manner that eight sets of electronic component mountingpositions 16 a set to the board 16 are sequentially surrounded by theimage acquisition range 18. Thereafter, this first camera 34 isevacuated from the upper area of this board 16. Then, the images takenby the first camera 34 are processed by the first recognition processingunit 55, and a next investigation process operation is carried out.

First, as to images of four sets of left-sided image acquisition ranges18, mounting conditions of the chips 6 are investigated. That is to say,a check is made as to whether or not positions/attitudes of the chips 6,and sticking-out conditions of the adhesive agent 17 are normalconditions. Then, as to four sets of right-sided image acquisitionranges 18, positions of the electronic component mounting positions 16 aof the board 16 are detected, and also, coating conditions of theadhesive agent 17 coated inside the electronic component mountingpositions 16 a before the chips 6 are mounted are investigated.

Next, as indicated in FIG. 8B, the mounting head 33 in which the fourchips 6 have been held by the respective absorbing nozzles 33 a is movedover the third camera 15, namely performs a scanning operation. As aresult, images of the chips 6 held by the respective absorbing nozzles33 a are acquired by the third camera 15, and then, these acquiredimages are processed by the third recognition processing unit 57, sothat actual positions of these four chips may be detected.

Thereafter, as indicated in FIG. 9A, the mounting head 33 is transportedover the first board holding mechanism 10A of the board holding unit 10.Next, similar to FIG. 7B, the chips 6 held by the mounting head 33 aremounted on four sets of electronic component mounting positions 16 a ofthe board 16, which are set under non-mounting conditions. As a result,as shown in FIG. 10D, the mounting operations of the chips 6 onto eightpieces of the electronic component mounting positions 16 a of the board16 are accomplished. Then, while the chips 6 are mounted by thismounting head 33, the second camera 35 is again transported over thechips 6 of the electronic component supplying unit 2, and such chips 6which will be picked up in next time are taken by the second camera 35.

Then, as shown in FIG. 9B, when the second camera 35 is evacuated fromthe upper portion of this chip 6, the mounting head 33 is transportedover the electronic component supplying unit 2, and the chips 6 aresequentially picked up by the four absorbing nozzles 33 c of themounting head 33 based upon the positions of the chips 6 acquired by thesecond recognition processing unit 56.

In conjunction with this operation, the first camera 34 is transportedover the board 16 held by the first board holding mechanism 10A of theboard holding unit 10. Then, the first camera 34 is sequentiallytransported in such a manner that the image acquisition range 18sequentially surrounds four sets of right-sided electronic componentmounting positions 16 a among eight sets of the electronic componentmounting positions 16 a which are set to the board 16, and then, thisfirst camera 34 acquires an image of the image acquisition range 18.

Then, the image of the image acquisition range 18 taken by the firstcamera 34 is processed by the first recognition processing unit 55 so asto investigate mounting conditions of the chips 6 in the electroniccomponent mounting positions 16 a of the board 16. After thisinvestigation of the mounting condition, the board 16 is brought outfrom the first board holding mechanism 10A to the boardreceiving/supplying unit 13, and a new board 16 is carried into thefirst board holding mechanism 10A.

Also, the first camera 34 which has completed the image taking operationat the first board holding mechanism 10A is transported over such aboard 16 held by the second board holding mechanism 10B, on which thechips 6 have not yet been mounted. At this plane, the first camera 34takes an image of such an electronic component mounting position 16 a onwhich the chips are subsequently scheduled to be mounted, so that aposition of the electronic component mounting position 16 a is detected,and also a coating condition of the adhesive agent 17 is investigated.

Subsequently, similar operations to the above-described operations arerepeatedly carried out. In other words, in the above-describedelectronic component mounting method, both the first camera 34 fortaking an image of the board 16 and the mounting head 33 for mountingthereon the chips 6 alternately access the board holding unit 10,whereas both the second camera 35 for taking images of the chips 6 andthe mounting head 33 for picking up the chips 6 alternately access theelectronic component supplying unit 2. As a result, the occurrence ofloss time in the mounting operation can be avoided during which none ofworks is carried out in both the board holding unit 10 and theelectronic component supplying unit 2.

In the electronic component mounting apparatus according to thisembodiment mode, an image of the board of the board holding unit 10 istaken by the first camera 34 so as to execute various sorts ofinvestigation/detection process operations by the first recognitionprocess unit 55 while utilizing such a time duration during which themounting head 33 performs the pick-up operation. Also, images of thechips 6 of the electronic component supplying unit 2 are taken by thesecond camera 35 in order to detect the positions of the chips 6 by thesecond recognition processing unit 56 while utilizing such a timeduration during which the mounting head 33 executes the mountingoperation. Alternatively, an image of the board of the board holdingunit 10 may be taken by the first camera 34 so as to execute varioussorts of investigation/detection process operations by the firstrecognition process unit 55 while utilizing such a time duration duringwhich the mounting head 33 performs the pick-up operation and the isscanning operations. Also, alternatively, images of the chips 6 of theelectronic component supplying unit 2 may be taken by the second camera35 in order to detect the positions of the chips 6 by the secondrecognition processing unit 56 while utilizing such a time durationduring which the mounting head 33 executes the mounting operation andthe scanning operation. Since such an alternative process operation iscarried out, temporal spare time may be produced in the image takingoperations by the first camera 34 and the second camera 35. As aconsequence, the stable operations of the electronic component mountingapparatus may be maintained.

Furthermore, since a plurality of chips 6 are picked up so as to bemounted within a single mounting turn, a total transport distance ofeach of these beam members can be shortened, so that work efficienciescan be increased.

It should also be noted that both the coating condition investigationand the mounting condition investigation are carried out in theelectronic component mounting apparatus according to this embodimentmode. Alternatively, either one or both of these coatingcondition/mounting condition investigation may be omitted during theelectronic component mounting operation.

In accordance with the present invention, while the electronic componentmounting apparatus is provided with the mounting head transportingmechanism for transporting the mounting head which mounts/transports theelectronic component between the electronic component supplying unit andthe board holding unit; the first camera transporting mechanism fortransporting the first camera which takes an image of the board in theboard holding unit over at least the board holding unit; and the secondcamera transporting mechanism for transporting the second camera whichtakes an image of the electronic component of the electronic componentsupplying unit over at least the electronic component supplying unit,since both the electronic component supplying unit and the board holdingunit are defined as the range to be transported, and the mounting head,the first camera, and the second camera are relatively traveled inconjunction to each other, the occurrence of loss time in both theelectronic component supplying unit and the board holding unit can beavoided, and the tact time can be shortened to improve the workefficiency.

1. An electronic component mounting method executed by an electroniccomponent mounting apparatus comprising: a mounting head for picking upan electronic component of an electronic component supplying unit tohold the picked electronic component, and for mounting said heldelectronic component on an electronic component mounting position of aboard held by a board holding unit; a mounting head transportingmechanism for transporting said mounting head between said electroniccomponent supplying unit and said board holding unit; a first camera fortaking an image of the board held by said board holding unit; a firstcamera transporting mechanism for transporting said first camera over atleast said board holding unit; a first recognition processing unit forprocessing an image taken by said first camera so as to acquire anactual position of said electronic component mounting position of theboard held by said board holding unit; a second camera for taking animage of the electronic component of said electronic component supplyingunit; a second camera transporting mechanism for transporting saidsecond camera over at least said electronic component supplying unit; asecond recognition processing unit for processing an image of saidsecond camera so as to acquire a position of the electronic component ofsaid electronic component supplying unit; said electronic mountingmethod comprising: a first step in which said second camera istransported to said electronic component supplying unit by said secondcamera transporting mechanism to take an image of an electroniccomponent, and thereafter said second camera is evacuated from an upperarea of said electronic component by said second camera transportingmechanism; a second step in which an image taken by said second camerais processed by said second recognition processing unit so as to acquirea position of said electronic component; a third step in which whilesaid mounting head transporting mechanism executes a positioningoperation for positioning said mounting head to said electroniccomponent based upon the position of the electronic component acquiredby said second recognition processing unit, said electronic component ispicked up by said mounting head; a fourth step in which said firstcamera is transported by said first camera transporting mechanism over aboard held by said board holding unit so as to take an image of saidboard by said first camera, and thereafter said first camera isevacuated from an upper area of said board by said first cameratransporting mechanism; a fifth step in which the image taken by saidfirst camera is processed by said first recognition processing unit soas to acquire an actual position of said electronic component mountingposition of the board; and a sixth step in which while said mountinghead transporting mechanism executes a positioning operation forpositioning said mounting head to said electronic component mountingposition based upon the actual position of said electronic componentmounting position acquired by said first recognition processing unit,the electronic component held by said mounting head is mounted on saidelectronic component mounting position; wherein while said electroniccomponent held by the mounting head is mounted on said electroniccomponent mounting position, said second camera is again transportedover said electronic component supporting unit so as to take an image ofan electronic component which is subsequently picked up by said mountinghead.
 2. The electronic component mounting method according to claim 1,wherein said first camera takes an image of the electronic componentmounting position of said board so as to acquire an image thereof insaid fourth step, and said first recognition processing unit processessaid image in order to acquire the actual position of said electroniccomponent mounting position in said fifth step.
 3. The electroniccomponent mounting method according to claim 1, wherein said firstcamera takes images of both said electronic component mounting positionand adhesive agent coated at said electronic component mounting positionso as to acquire images thereof in said fourth step, and wherein saidfirst recognition processing unit processes said acquired images inorder to acquire the actual position of said electronic componentmounting position and also to investigate a coating condition ofadhesive agent coated at said electronic component mounting position insaid fifth step.
 4. The electronic component mounting method accordingto any one of claim 1 to claim 3, wherein said electronic componentmounting method is further comprised of: a seventh step in which saidfirst camera transporting mechanism transports said first camera over anelectronic component mounting position of said board on which theelectronic component has been mounted so as to take an image of saidelectronic component mounting position; and an eight step in which theimage taken in said seventh step is processed by said first recognitionprocessing unit so as to investigate a mounting condition of saidelectronic component.
 5. The electronic component mounting methodaccording to claim 4, wherein the subsequent fourth step is continuouslycarried out after said seventh step.
 6. An electronic component mountingmethod executed by an electronic component mounting apparatuscomprising: a mounting head for picking up an electronic component of anelectronic component supplying unit to hold the picked electroniccomponent, and for mounting said held electronic component on anelectronic component mounting position of a board held by a boardholding unit; a mounting head transporting mechanism for transportingsaid mounting head between said electronic component supplying unit andsaid board holding unit; a first camera for taking an image of the boardheld by said board holding unit; a first camera transporting mechanismfor transporting said first camera over at least said board holdingunit; a first recognition processing unit for processing an image takenby said first camera so as to acquire an actual position of saidelectronic component mounting position of the board held by said boardholding unit; a second camera for taking an image of the electroniccomponent of said electronic component supplying unit; a second cameratransporting mechanism for transporting said second camera over at leastsaid electronic component supplying unit; a second recognitionprocessing unit for processing an image of said second camera so as toacquire a position of the electronic component of said electroniccomponent supplying unit; said electronic mounting method comprising: afirst step in which said second camera is transported to said electroniccomponent supplying unit by said second camera transporting mechanism totake images of a plurality of electronic components, and thereafter saidsecond camera is evacuated from an upper area of said plural electroniccomponents by said second camera transporting mechanism; a second stepin which images taken by said second camera are processed by said secondrecognition processing unit so as to acquire positions of said pluralelectronic components; a third step in which while said mounting headtransporting mechanism executes a positioning operation for sequentiallypositioning said mounting head to said plural electronic componentsbased upon the positions of the plural electronic components acquired bysaid second recognition processing unit, said plural electroniccomponents are sequentially picked up by said mounting head; a fourthstep in which said first camera is transported by said first cameratransporting mechanism over a board held by said board holding unit soas to take an image of said board by said first camera, and thereaftersaid first camera is evacuated from an upper area of said board by saidfirst camera transporting mechanism; a fifth step in which the imagetaken by said first camera is processed by said first recognitionprocessing unit so as to acquire actual positions of said pluralelectronic component mounting positions of said board; and a sixth stepin which while said mounting head transporting mechanism executes apositioning operation for sequentially positioning said mounting head tosaid plural electronic component mounting positions based upon thepositions of said plural electronic component mounting positionsacquired by said first recognition processing unit, the pluralelectronic components held by said mounting head are sequentiallymounted on said plural electronic component mounting positions; whereinwhile said electronic components held by the mounting head aresequentially mounted on said plural electronic component mountingpositions, said second camera is again transported over said electroniccomponent supporting unit so as to take images of a plurality ofelectronic components which are subsequently picked up by said mountinghead.
 7. The electronic component mounting method according to claim 6,wherein said first camera takes images of a plurality of electroniccomponent mounting positions of said board so as to acquire imagesthereof in said fourth step, and wherein said first recognitionprocessing unit processes said images in order to acquire the actualpositions of said plural electronic component mounting positions in saidfifth step.
 8. The electronic component mounting method according toclaim 6, wherein said first camera takes images of both said pluralelectronic component mounting positions and adhesive agent coated atsaid plural electronic component mounting positions so as to acquireimages thereof in said fourth step, and wherein said first recognitionprocessing unit processes said acquired images in order to acquire theactual positions of said plural electronic component mounting positionsand also to investigate coating conditions of adhesive agent coated atsaid plural electronic component mounting positions in said fifth step.9. The electronic component mounting method according to any one ofclaim 6 to claim 8, wherein said electronic component mounting methodfurther comprises: a seventh step in which said first cameratransporting mechanism transports said first camera over a plurality ofelectronic component mounting positions of said board on which theelectronic components have been mounted so as to take images of saidplural electronic component mounting positions; and an eighth step inwhich the images taken in said seventh step are processed by said firstrecognition processing unit so as to investigate mounting conditions ofsaid plural electronic components.
 10. The electronic component mountingmethod according to claim 9, wherein the subsequent fourth step iscontinuously carried out after said seventh step.